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MAX V Devices

The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.

Device:

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Showing 1 - 20 / 24 Entries

Device	Part Number	Package Type	Pins	Silicon	Package Description
5M1270Z	5M1270ZT144	TQFP	144	Production	144-Pin TQFP - Wire Bond - A:1.60
5M1270Z	5M1270ZF256	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
5M1270Z	5M1270ZF324	FBGA	324	Production	324-Pin FBGA-THIN - Wire Bond - A:1.55
5M160Z	5M160ZE64	EQFP	64	Production	64-Pin EQFP - Wire Bond - A:1.20 - D2:4.50
5M160Z	5M160ZM68	MBGA	68	Production	68-Pin MBGA - Wire Bond - A:1.20
5M160Z	5M160ZM100	MBGA	100	Production	100-Pin MBGA - Wire Bond - A:1.20
5M160Z	5M160ZT100	TQFP	100	Production	100-Pin TQFP - Wire Bond - A:1.20
5M2210Z	5M2210ZF256	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
5M2210Z	5M2210ZF324	FBGA	324	Production	324-Pin FBGA-THIN - Wire Bond - A:1.55
5M240Z	5M240ZM68	MBGA	68	Production	68-Pin MBGA - Wire Bond - A:1.20
5M240Z	5M240ZM100	MBGA	100	Production	100-Pin MBGA - Wire Bond - A:1.20
5M240Z	5M240ZT100	TQFP	100	Production	100-Pin TQFP - Wire Bond - A:1.20
5M240Z	5M240ZT144	TQFP	144	Production	144-Pin TQFP - Wire Bond - A:1.60
5M40Z	5M40ZE64	EQFP	64	Production	64-Pin EQFP - Wire Bond - A:1.20 - D2:4.50
5M40Z	5M40ZM64	MBGA	64	Production	64-Pin MBGA - Wire Bond - A:1.20
5M570Z	5M570ZE64	EQFP	64	Production	64-Pin EQFP - Wire Bond - A:1.20 - D2:4.50
5M570Z	5M570ZM100	MBGA	100	Production	100-Pin MBGA - Wire Bond - A:1.20
5M570Z	5M570ZT100	TQFP	100	Production	100-Pin TQFP - Wire Bond - A:1.20
5M570Z	5M570ZT144	TQFP	144	Production	144-Pin TQFP - Wire Bond - A:1.60
5M570Z	5M570ZF256	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55

Showing 1 - 20 / 24 Entries

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