封装

Cyclone III Devices

The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.

Device:

Keywords:

Showing 1 - 20 / 43 Entries

Device	Part Number	Package Type	Pins	Silicon	Package Description
EP3C10	EP3C10E144	EQFP	144	Production	144-Pin EQFP - Wire Bond - A:1.65 - D2:5.40
EP3C10	EP3C10M164	MBGA	164	Production	164-Pin MBGA - Wire Bond - A:1.20
EP3C10	EP3C10F256	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
EP3C10	EP3C10U256	UBGA	256	Production	256-Pin UBGA - Wire Bond - A:1.50
EP3C120	EP3C120F484	FBGA	484	Production	484-Pin FBGA - Wire Bond - A:2.40
EP3C120	EP3C120F780	FBGA	780	Production	780-Pin FBGA - Wire Bond - A:2.40
EP3C16	EP3C16E144	EQFP	144	Production	144-Pin EQFP - Wire Bond - A:1.65 - D2:6.610
EP3C16	EP3C16M164	MBGA	164	Production	164-Pin MBGA - Wire Bond - A:1.20
EP3C16	EP3C16Q240	PQFP	240	Production	240-Pin QFP - Wire Bond - A:4.10
EP3C16	EP3C16F256	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
EP3C16	EP3C16U256	UBGA	256	Production	256-Pin UBGA - Wire Bond - A:1.50
EP3C16	EP3C16F484	FBGA	484	Production	484-Pin FBGA - Wire Bond - A:2.40
EP3C16	EP3C16U484	UBGA	484	Production	484-Pin UBGA - Wire Bond - A:2.05
EP3C25	EP3C25E144	EQFP	144	Production	144-Pin EQFP - Wire Bond - A:1.65 - D2:6.610
EP3C25	EP3C25Q240	PQFP	240	Production	240-Pin QFP - Wire Bond - A:4.10
EP3C25	EP3C25F256	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
EP3C25	EP3C25U256	UBGA	256	Production	256-Pin UBGA - Wire Bond - A:1.50
EP3C25	EP3C25F324	FBGA	324	Production	324-Pin FBGA - Wire Bond - A:1.90
EP3C40	EP3C40Q240	PQFP	240	Production	240-Pin QFP - Wire Bond - A:4.10
EP3C40	EP3C40F324	FBGA	324	Production	324-Pin FBGA - Wire Bond - A:1.90

Showing 1 - 20 / 43 Entries

有关 PCB 制造信息和资源，请访问主板开发人员中心。